ASEM TECHNOLOGY SDN. BHD.
(+6) 012- 525 0560
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An ISO 9001:2015 QMS Certified Company
Products
Copper Wire Bonding System & Nozzle Kit
This product is jointly developed with multinational company. It has capability to detect gas flow of 0 to 5 LPM at 0.1 resolution. The system is applicable to the conversion process of gold wire to copper bonding. It has been successfully qualified in Malaysia and China company since 2009 to be used with machine model of ASM319, ASM Harrier, Eagle 60 and Shinkawa, ACB 35, 200, 250, 400, 1000.
Surplus Machines
We trade various type of semiconductor surplus machines as shown below and more.
Alphasem E8032 Die Attach
ASM AB559 Wire Bonder
ASM 809-08 Die Attach
ASM AD896 Die Attach
Blue M Oven
Surplus machine segments available are:
Spare Parts Trading
LED Ring Light
Machine Control Boards
Servo Motor
ASM Eagle 60 Spark Rod
Dage Wire Pull Tool
ESEC 3600 Spark Rod
ASM339 138 KHz Transducer
Kaijo Capillary Screw
ASM339 Capillary Screw
Dage Die Shear Tool
Ultrasonic Generator
Vesper Pick Up Tool
Bond Head Linear Motor
Bond Slider Cable
E8003 No Chip Sensor
Spare parts available are:
Product Distribution
Reflow Oven Filter
Reflow Oven
Micro Power MEM's Mass Flow Sensor
Insertion Mass Flow Meter
Mass Flow Meter
Low Power Mass Flow Meter
Low Flow Meter
Mass Flow Sensor (MF4000)
Mass Flow Sensor (Medical)